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Manufacturing(1) |
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SMD capability PCB SIZE:508mm*508mm PCB Thickness:0.5mm-5.0mm 0201SMD 150g SMD Max Smd:150mm×25mm Max SMD Pitch:0.3mm Min BCA Pitch:0.3mm Min BGA Ball Pitch:0.3mm Min POP Placement 1.2×10 CPM Max
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Manufacturing(2) |
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Solder Paste Inspection SPI(3D) AOI(2D+3D) X-ray(2D) BGA rework W/S SIZE:610*610MM Max Ultrasonic cleaning Di Water Solvent cleaning Milling cutter |
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Enterprise management |
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QAD Customer (order/invoice forecast) Supply chain(Storage Purchasing) Manufacture(Product structure Workflow MPS MRP lean manufacturing quality management) WMS Materials Management(solder paste Moisture-sensitive devices Baking) Materials tracing(Lot no. FIFO Racks work order ) MES Material list/craft control/lot tracing/process management/IQ inspection/data input/logic control
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| Normal product plan | ||
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Preparation
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| Automotive product plan | ||
|
DF”X”is design of production circle |
DFM |
Simplification and improvement |
|
DFA |
Assembly design |
|
|
DFT |
Fesibility and reliablility design |
|
|
DFP |
purchasing plan |
|
|
Structure design |
Simple and reliable |
|
|
The mothod of FEMA reliability design |
DFEMA |
Failure mode analyse |
|
PEMEA |
Potential process fail mode and effection |
|
|
PPAP |
Production Part Approval |
|
|
APQP |
Advanced Product Quality Planning |
|
|
Manufacturing(1) |
Manufacturing(2) |
Enterprise management |
|
SMD capability PCB SIZE:508mm*508mm PCB Thickness:0.5mm-5.0mm 0201SMD 150g SMD Max Smd:150mm×25mm Max SMD Pitch:0.3mm Min BCA Pitch:0.3mm Min BGA Ball Pitch:0.3mm Min POP Placement 1.2×10 CPM Max
|
Solder Paste Inspection SPI(3D) AOI(2D+3D) X-ray(2D) BGA rework W/S SIZE:610*610MM Max Ultrasonic cleaning Di Water Solvent cleaning Milling cutter |
QAD Customer (order/invoice forecast) Supply chain(Storage Purchasing) manufacture(Product structure Workflow MPS MRP lean manufacturing quality management) WMS Materials Management(solder paste Moisture-sensitive devices Baking) Materials tracing(Lot no. FIFO Racks work order ) MES material list/craft control/lot tracing/process management/IQ inspection/data input/logic control
|
|
Normal product plan |
Automotive product plan |
||
|
Preparation Drawings,craft files Internal evaluation File,device and module evaluation Trial run manufacturing process and planning team training Product and craft introduction First sample test Trial amounts production Craft internal evaluation Craft summary Trial run summary Trial run report |
DF”X”is design of production circle |
DFM |
Simplification and improvement |
|
DFA |
Assembly design |
||
|
DFT |
Fesibility and reliablility design |
||
|
DFP |
Purchasing plan |
||
|
Structure design |
Simple and reliable |
||
|
The mothod of FEMA reliability design |
DFEMA |
Failure mode analyse |
|
|
PEMEA |
Potential process fail mode and effection |
||
|
PPAP |
Production Part Approval |
||
|
APQP |
Advanced Product Quality Planning |
||
