|
Trade Standard(一) |
Quality control tools |
|
|
Applied standard |
Applicable level |
MSA Measurement System Analysis DOE Design Of Experiments CP Control Plan 7 QC Tools(Pareto Diagram、Flowchart、Histogram、Fishbone Diagram、5why、Matrix Chart、Quality Management Process) 5Why Problem-analysis 5W1H Job Analysis Methods PCDA |
|
IPC-A-610F |
Class Ⅱ OR Class Ⅲ |
|
|
IPC-7527(L)Requirements for Solder Paste Printing |
Class Ⅱ OR Class Ⅲ |
|
|
IPC-A-600G- Acceptability of Printed Boards |
Class Ⅱ OR Class Ⅲ |
|
|
IPC-CH-65B The cleaning of printed boards and assemblies |
||
|
IPC-CH-65B Acceptability of Printed Boards |
||
|
J-STD-032 Performance Standard for Ball Grid Array Balls |
||
|
IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies |
||
|
IPC-J-STD-033SMD（Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices） |
||
|
IPC-7711&7721CN Rework and Repair of Printed Boards and Assemblies |
||
|
IPC-9704 Printed Circuit Assembly Strain Gage Test Guideline |
||
|
ANSI-IPC-ESD-S20(Interpretation of ESD Association Standards) |
||
|
IPC-TM-650 Test methods manual |
||
|
Trade Standard |
Quality control tools |
|
|
Applied standard |
Applicable level |
MSA Measurement System Analysis DOE Design Of Experiments CP Control Plan 7 QC Tools(Pareto Diagram、Flowchart、Histogram、Fishbone Diagram、5why、Matrix Chart、Quality Management Process) 5Why Problem-analysis 5W1H Job Analysis Methods PCDA |
|
IPC-A-610F |
Class Ⅱ OR Class Ⅲ |
|
|
IPC-7527(L)Requirements for Solder Paste Printing |
Class Ⅱ OR Class Ⅲ |
|
|
IPC-A-600G-600G Acceptability of Printed Boards |
Class Ⅱ OR Class Ⅲ |
|
|
IPC-CH-65B The cleaning of printed boards and assemblies |
||
|
IPC-CH-65B Acceptability of Printed Boards |
||
|
J-STD-032 Performance Standard for Ball Grid Array Balls |
||
|
IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies |
||
|
IPC-J-STD-033SMD（Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices） |
||
|
IPC-7711&7721CN Rework and Repair of Printed Boards and Assemblies |
||
|
IPC-9704 Printed Circuit Assembly Strain Gage Test Guideline |
||
|
ANSI-IPC-ESD-S20(Interpretation of ESD Association Standards) |
||
|
IPC-TM-650 Test methods manual |
||
